Specification: Viscosity: 100 (Pa S) Particle
Size: 20-38 (um) Alloy composition: lead tin paste Weight: 35g The product has good wettability, good dry resistance, & long shelf life at room temperature. It is suitable for mobile phone repair industry, computer digital repair industry, precision circuit board SMT soldering, BGA process soldering, etc. Package included:1 x SMT BGA Syringe Flux Tin Soldering Paste Syringe Solder Paste RC Model Spare Part